Dieline summit

Paris - ile de france

Launched jointly by the international EMBALLAGE exhibition and The Dieline, the first edition of "The Dieline Summit" - will be held at the Palais des Congrès in Paris on the 16th and 17th November. This one-of-a-kind forum is inspired by the theme "WHAT IS THE FUTURE OF PACKAGE DESIGN?" It is aimed at professional designers, and packaging enthusiasts, aiming to reinvent packaging design in the presence of some of the sector's leading stakeholders.

site de l'événement

Lieu de l'événement

Palais des Congres, 2 Place de la Porte Maillot, Paris, 75017, France

Email

contacter l’organisateur

Organisateur

• COMEXPOSIUM

Conditions d'accès

Tout public

http://atnd.it/16191-0

Auteur de l'annonce

BEMYAPP

Evénements dans cette thématique